All items tagged with wireless earbuds and piezoelectric MEMS (16)

xMEMS Partners with Rayking to Accelerate Adoption of Cypress MEMS Speaker in Wireless Earbuds

September 15, 2025 by Joao Martins

xMEMS Partners with Rayking to Accelerate Adoption of Cypress MEMS Speaker in Wireless Earbuds

xMEMS Labs announced a strategic partnership with Dongguan Rayking Electronics to co-develop a turnkey Cypress + Alta-S speaker module for next-generation TWS earbuds. The collaboration follows xMEMS announcement that Cypress and its companion Alta-S ASIC are now ready for mass production. A manufacturer of electret condenser microphones (ECM) and MEMS microphones, Rayking is highly recognized in consumer electronics, from notebooks and mobile phones to Bluetooth devices and car electronics.

xMEMS Announces Mass Production of Cypress Full-Range PiezoMEMS Ultrasonic Transducer

September 10, 2025 by Joao Martins

xMEMS Announces Mass Production of Cypress Full-Range PiezoMEMS Ultrasonic Transducer

xMEMS Labs announced that its Cypress full-range MEMS “sound-from-ultrasound” microspeaker, together with the Alta-S companion drive ASIC, is now ready for mass production. This represents the industry’s first commercially viable full-range solid-state audio solution capable of meeting the demanding Sound Pressure Level (SPL) requirements for noise-cancelling true wireless stereo (TWS) earbuds. It also indicates that xMEMS is fully convinced that the device will be deemed safe to humans and for extended usage inside the ears.

xMEMS Introduces Amplifier-Less MEMS Tweeter for 2-Way Wireless Earbuds

March 27, 2025 by Joao Martins

xMEMS Introduces Amplifier-Less MEMS Tweeter for 2-Way Wireless Earbuds

xMEMS unveiled Lassen, the company’s latest member of its growing µFidelity range of MEMS drivers, and the first “amplifier-less” MEMS tweeter optimized for 2-way True Wireless Stereo (TWS) earbuds. According to xMEMS, Lassen brings a number of advantages with no need for a piezo amplifier, reducing cost, size, and power consumption while maintaining exceptional sound performance with up to 115dB SPL in the 6kHz–20kHz range. For manufacturers, Lassen lowers integration costs by 25% making room for other advanced features, and allowing consistent sound quality in mass production.

xMEMS Announces General Availability of First Solid-State Fidelity, All-Silicon Microspeakers

April 18, 2023 by Joao Martins

xMEMS Announces General Availability of First Solid-State Fidelity, All-Silicon Microspeakers

Following the announcement of the world's first true MEMS microspeaker in July 2020, xMEMS Labs now announced general availability of three solutions for immediate integration into next-generation true wireless stereo (TWS) earphones, in-ear-monitors (IEMs), hearing aids, and other emerging personal audio designs. Offering the advantages of Solid-State Fidelity and DynamicVent technology, xMEMS is determined to change the market through vastly superior audio experiences and improved consumer listening comfort.

xMEMS Announces World's First Solid-State MEMS DynamicVent, Enabling Active Ambient Control for Next-Generation TWS and Hearing Aids

January 9, 2023 by Joao Martins

xMEMS Announces World's First Solid-State MEMS DynamicVent, Enabling Active Ambient Control for Next-Generation TWS and Hearing Aids

Part of xMEMS Labs announcements at CES 2023, the innovative MEMS speaker company introduced Skyline, the world’s first discrete solid-state MEMS DynamicVent, a specific design with a valve that opens or closes by sensor fusion input from the earbud DSP and enables the benefits of both an open-fit (spatially aware) and closed-fit (occluded) earbud design. This enables smart TWS earbuds and hearing aids that create best-of-both-worlds user experiences in the same product.

Luxshare-ICT Selects USound as Strategical MEMS Speaker Supplier For Next-Generation TWS

November 28, 2022 by audioXpress Staff

Luxshare-ICT Selects USound as Strategical MEMS Speaker Supplier For Next-Generation TWS

Austrian MEMS piezoelectric microspeaker specialist USound announced an agreement with Luxshare-ICT, one of the largest manufacturers and supplier for global consumer electronics brands. Luxshare-ICT chose USound as its strategical MEMS speaker supplier for its new ultra-compact hybrid audio module intended to power next-generation innovative dual-driver true wireless stereo (TWS) earbuds. The new Luxshare-ICT audio TWS solution will be in mass production in 2023.

Vesper Launches 2nd Generation Smart Piezoelectric Voice Accelerometer with ZeroPower Sensing

March 28, 2022 by Joao Martins

Vesper Launches 2nd Generation Smart Piezoelectric Voice Accelerometer with ZeroPower Sensing

Vesper continues to redefine its range of MEMS solutions for voice applications with the launch of the VA1210, Vesper’s 2nd generation analog piezoelectric smart voice accelerometer. The VA1210 offers higher sensitivity (+17 dB) and higher (+6 dB) SNR than the 1st generation VA1200 in voice pickup. Additionally, new intelligent features of Wake-on-Voice (WoV) and hardware voice activity detection (HVAD), introduced into the VA1210, enable a drastic improvement of voice quality True Wireless Stereo (TWS) earbuds.

xMEMS Samples Ultra-Small Full-Range Microspeaker

November 4, 2021 by Mike Klasco

xMEMS Samples Ultra-Small Full-Range Microspeaker

Back in January 2015, I gave a talk about MEMS loudspeakers, and I have regularly written about MEMS speaker progress. A half decade later, it seems we are finally now moving beyond the industry's joke that MEMS’ development progress can be measured in dog years: it takes 7 human years for each year of MEMS’ progress! The big news is xMEMS Labs, a company founded just in January 2018, has announced it is now in mass production of its Montara, a monolithic MEMS “µspeaker” with a slim 1mm profile, and announced Cowell, the world’s smallest monolithic MEMS µSpeaker, at just 1.15mm high and 3.2mm wide.

September 29, 2021 by audioXpress Staff

Vesper Completes $16M Financing to Accelerate Growth

Vesper, the pioneer in piezoelectric MEMS microphones and sensors that is now empowering edge-AI applications in consumer devices, closed a $18M financing round led by Accomplice. Vesper also received investments from Applied Materials Ventures, Sands Capital, Bose, Amazon Alexa Fund, Gopher Asset Management, ITIC, World Peace Group, Unitrontech, and MegaChips. The round brings Vesper's total funding to date to $73M.

Vesper Introduces Analog Piezoelectric Voice Accelerometer for True Wireless Earbuds

April 19, 2021 by audioXpress Staff

Vesper Introduces Analog Piezoelectric Voice Accelerometer for True Wireless Earbuds

Vesper introduced the VA1200, which the company calls the world’s first analog piezoelectric voice accelerometer (a.k.a. bone conduction sensor). This low-power vibration sensor can be used in true wireless earbud designs to pick up the wearer’s own voice through bone conduction. Using the VA1200 in conjunction with a standard microphone and a sensor fusion solution, the application can achieve superior background and wind noise reduction. Vesper calls this combination OnePlusOne.

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