Originally announced in 2023, the Cypress MEMS speaker from xMEMS Labs is able to achieve louder bass response on a single monolithic, miniaturized device, achieving well above the 130dB SPL at low frequencies, required for ANC implementations on TWS earbuds. In fact, the first production piezoMEMS ultrasonic transducer from xMEMS delivers the key 140dB@20Hz SPL threshold for next-generation ANC earbuds. This groundbreaking performance results from using ultrasound technology generated by its silicon diaphragm and monolithic solid-state construction.
The device’s lightning-fast mechanical response and flat, near-zero phase response allow earbuds to achieve wider-bandwidth noise suppression, improved passive noise isolation, and unprecedented sound clarity in a package just 46mm³ and weighing only 98 milligrams. It can replace bulky dynamic drivers directly, freeing valuable space for advanced sensors and longer-life batteries in compact, lightweight TWS designs.
“This is the most important milestone yet for our ultrasonic transducer platform and in our mission to bring full-range solid-state audio to wireless earbuds,” says Dr. Chiung Lo, VP of Engineering at xMEMS Labs. “By pairing Cypress with Alta-S, we’re accelerating the industry’s shift to MEMS-based audio — delivering superior sound quality, smaller form factors, and the proven reliability of silicon in the world’s most popular consumer audio device.”
Using ultrasonic amplitude modulation for audio reproduction means that, instead of pushing air in the audible band like traditional coil speakers, the MEMS driver generates ultrasonic pulses modulated to mirror the audio signal. “As these pulses are demodulated in the air, they transform into rich, detailed sound that more faithfully captures the original recording,” xMEMS states.
“This breakthrough delivers superior time-domain resolution for high-resolution and spatial audio, while producing 40x louder low frequencies than prior xMEMS designs. With SPLs exceeding 140dB as low as 20Hz, Cypress finally makes sound-from-ultrasound a commercially viable, high-performance alternative to legacy moving-coil speakers for ANC earbuds,” the company adds.
Cypress and Alta-S are available for sampling immediately, with customer mass production shipments expected in 2026. Demonstrations will take place at the company’s annual xMEMS Live 2025 seminar series on September 16 in Taipei and September 18 in Shenzhen. xMEMS will also demonstrate an architecture that pairs its Sycamore ultrasound MEMS loudspeaker with µCooling, the first air pump-on-a-chip to reduce moisture build-up in a lighter, thinner, and more comfortable headphone experience.
Sycamore loudspeakers and µCooling devices are now available to select early access customers, with volume production also targeted for the second half of 2026. xMEMS has over 250 granted patents worldwide for its technology.
www.xmems.com
