All items tagged with ASIC (20)

Gettop and USound Sign Strategic Sales and Supply Agreement for MEMS Speaker Production

September 22, 2025 by Joao Martins

Gettop and USound Sign Strategic Sales and Supply Agreement for MEMS Speaker Production

USound, the MEMS speakers pioneer that is now expanding its portfolio with AI-based acoustic sensing solutions, has signed a strategic agreement for MEMS wafer technology with Gettop Acoustic, a renowned global provider of acoustic components. Under the agreement, Gettop will manufacture MEMS speakers using USound’s MEMS wafers and ASICs, achieving guaranteed production volumes and establishing a framework in sales and market development.

xMEMS Partners with Rayking to Accelerate Adoption of Cypress MEMS Speaker in Wireless Earbuds

September 15, 2025 by Joao Martins

xMEMS Partners with Rayking to Accelerate Adoption of Cypress MEMS Speaker in Wireless Earbuds

xMEMS Labs announced a strategic partnership with Dongguan Rayking Electronics to co-develop a turnkey Cypress + Alta-S speaker module for next-generation TWS earbuds. The collaboration follows xMEMS announcement that Cypress and its companion Alta-S ASIC are now ready for mass production. A manufacturer of electret condenser microphones (ECM) and MEMS microphones, Rayking is highly recognized in consumer electronics, from notebooks and mobile phones to Bluetooth devices and car electronics.

R&D Stories: How Optical Technology Enables a Generational Shift in MEMS Microphone Performance

December 13, 2023 by Jakob Vennerød and Kieran Harney

R&D Stories: How Optical Technology Enables a Generational Shift in MEMS Microphone Performance

The article summarizes the evolution of MEMS microphone technology and describes the benefits of optical microphones over conventional solutions. This is a crucial reading to understand how the first generation of optical MEMS microphones have smashed the limits of SNR and dynamic range of miniature microphones, with 80dBA SNR (14dBA noise floor), 132dB dynamic range, 24-bit digital output and all with ultra-low power consumption.

HDBaseT Alliance to Standardize High-Performance USB 3.2 Extension

September 28, 2023 by Joao Martins

HDBaseT Alliance to Standardize High-Performance USB 3.2 Extension

The HDBaseT Alliance has announced the standardization of long-reach extension of USB 3.2 connectivity to address the need for a high-bandwidth, low-power, long-reach, compact technology in support of this interface that continues to be popular in AV applications. The new HDBaseT-USB3 standard is set to be implemented as an ASIC solution in the near future, and will empower manufacturers of audiovisual products for the first time ever to natively embed long-reach USB 3.2 and power extension into their products.

Nanusens Announces That It Can Now Create ASICs With Embedded Sensors

May 26, 2023 by audioXpress Staff

Nanusens Announces That It Can Now Create ASICs With Embedded Sensors

Nanusens has announced that it has successfully created a fully digital circuit design to measure the capacitance of its nanosensors. This means that both the sensor structure and its detection circuitry can be made at the same time within a chip using standard CMOS processes on whatever process node is required. As a result, ASICs can now be made with several different sensors embedded within them, helping to expand MEMS applications in hearables.

USound Launches Kore 4.0 Integrated MEMS Speaker Module for TWS and OTC Hearing Aids

March 17, 2023 by Joao Martins

USound Launches Kore 4.0 Integrated MEMS Speaker Module for TWS and OTC Hearing Aids

USound has launched Kore 4.0, a fully integrated audio module that incorporates Usound’s Tarvos, a brand new ultra-low power audio amplifier, and Conamara, its latest generation of MEMS drivers. According to the MEMS-based audio technology specialist, with its compact form factor, superior audio performance, and low power consumption, Kore 4.0 is an ideal match for hearables and Over-The-Counter (OTC) hearing aids.

Femtosense Brings Affordable First Silicon for Audio Applications to CES 2023

December 21, 2022 by audioXpress Staff

Femtosense Brings Affordable First Silicon for Audio Applications to CES 2023

Femtosense announced the arrival and successful testing of its first silicon, substantiating the startup’s assertions that it will deliver significantly more efficient, lower cost and real-time AI processing for valuable and affordable consumer electronics. At CES 2023, the Edge AI company will demonstrate compelling audio applications with highly efficient, real-time artificial intelligence (AI) processing with low power, low cost requirements.

USound New High-Performing ASIC Linear Audio Amplifier Boosts the Battery Life of TWS and Hearing Aids

October 24, 2022 by Joao Martins

USound New High-Performing ASIC Linear Audio Amplifier Boosts the Battery Life of TWS and Hearing Aids

Austrian MEMS speaker pioneer USound continues to pursue the integration of its patented drivers in solutions that are ready for manufacturers to use. Following the release of a complete audio module for true wireless earbuds and hearing aids, the company now announced the launch of a new ASIC linear audio amplifier, Tarvos 1.0 UC-P3010, purposely designed to drive USound MEMS speakers. This new audio amplifier also boosts the battery life, meeting or exceeding current market requirements.

Sonical Partners With Dolphin Design to Develop the Silicon for Open Hearables

September 5, 2022 by Joao Martins

Sonical Partners With Dolphin Design to Develop the Silicon for Open Hearables

Sonical, the Silicon Valley company developing an open software platform for hearables, announced a partnership with Dolphin Design, a leading edge computing and embedded AI silicon IP company, and a subsidiary of Soitec, an industry leader in designing and manufacturing innovative semiconductor materials. Together, the two companies are working on a heterogeneous computing platform to design ASIC/SoCs with an innovative operating system that will change the end-user experience with hearables.

MEMS Speaker Startup SonicEdge Establishes Business Unit at Sound Hub Denmark

August 9, 2022 by Joao Martins

MEMS Speaker Startup SonicEdge Establishes Business Unit at Sound Hub Denmark

SonicEdge, an Israeli startup working in MEMS speakers has registered a Danish business unit at Sound Hub Denmark in Struer. SonicEdge has developed an ultra-compact MEMS speaker solution based on a patented design and modulated ultrasound technology that promises to be significantly smaller, more energy-efficient and more robust without compromising on sound quality. Having found investors and clients in Denmark, SonicEdge is now looking to develop its business further and hire for its Danish R&D department.

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