Rohde & Schwarz and Ceva Announce Over-the-Air Bluetooth Test Solution

The next Bluetooth release is expected to be ratified soon. One important new feature is the Unified Test Protocol (UTP) Test Mode for Bluetooth Low Energy, that will complement existing test methods. The UTP Test Mode will additionally enable over-the-air (OTA) controlled device testing, which will simplify measurements of small and highly integrated devices enormously, since no direct wired connection to the tester is needed. Rohde & Schwarz and Ceva, in close cooperation, have developed a solution for this new test mode.

TDK Corporation has expanded its lineup of chip varistors with the new AVRF101U6R8KT242 for audio equipment, which offers both ESD and EMI protection. This new product is intended for audio equipment that uses wireless communications in the 2.4 GHz band. Thanks to optimization of its capacitance of 6.8 pF, the multilayer component features high attenuation at this frequency and is able to effectively suppress the generated TDMA noise and thus improve receiver sensitivity.