All items tagged with Wi-Fi 6E (22)

Renesas Lays Out Roadmap for Wi-Fi 6/6E and 7 Chipsets

November 18, 2022 by Joao Martins

Renesas Lays Out Roadmap for Wi-Fi 6/6E and 7 Chipsets

During the electronica 2022 show in Munich, Germany, Renesas Electronics unveiled plans to deliver a comprehensive set of advanced Wi-Fi offerings to complement its broad portfolio of industrial and connected products. In 2021, Renesas completed its acquisition of Celeno, a company from Israel specializing in wireless communication solutions, including advanced Wi-Fi chipsets for high-performance home networks, and is leveraging that technology to address a wide range WLAN access point applications for Wi-Fi 6/6E and Wi-Fi 7.

Bluetooth SIG Targets 6 GHz Frequency Band Mid-Band Spectrum Expansion Project

November 16, 2022 by audioXpress Staff

Bluetooth SIG Targets 6 GHz Frequency Band Mid-Band Spectrum Expansion Project

Following international trends and increasing use for Wi-Fi 6E, the Bluetooth Special Interest Group (SIG), the trade association that oversees Bluetooth technology, announced a new specification development project to define the operation of Bluetooth Low Energy (LE) in additional unlicensed mid-band spectrum, including the 6GHz frequency band. The new spectrum expansion project will help ensure that much needed Bluetooth performance enhancements can continue well into the future.

Synaptics’ Triple Combo Wireless System-on-Chip Wins "2022 Best of Sensors" Award

June 29, 2022 by audioXpress Staff

Synaptics’ Triple Combo Wireless System-on-Chip Wins "2022 Best of Sensors" Award

Synaptics received the "2022 Best of Sensors” Award for Connectivity with its SYN4381 Triple Combo, the industry’s first Matter-compliant SoC with integrated Wi-Fi 6/6E, Bluetooth 5.2, and 802.15.4/Thread. The award was presented at Sensors Converge 2022 in a ceremony that honors the best technologies in the large and growing ecosystem. Synaptics’ FlexSense 4-in-1 sensor fusion processor was also recognized as a Finalist in the “Best of Sensors” Awards’ for wearables.

Synaptics Launches Matter-Compliant Triple Combo SoC for Seamless Connectivity

February 3, 2022 by Joao Martins

Synaptics Launches Matter-Compliant Triple Combo SoC for Seamless Connectivity

Synaptics announced the SYN4381 Triple Combo system-on-chip (SoC), the first to combine Wi-Fi 6/6E (802.11ax with extended 6 GHz operation), Bluetooth 5.2 (BT 5.2) with BLE Audio and High Accuracy Distance Measurement (HADM), and IEEE 802.15.4 with built-in support for the Thread protocol and Matter application layer. The solution simplifies product development while supporting 600 Mbps video and data, low-power Thread communication, and platform-agnostic device setup and interoperability.

Wireless Innovation Accelerates in 2022 with Wi-Fi 6 and UWB

November 23, 2021 by audioXpress Staff

Wireless Innovation Accelerates in 2022 with Wi-Fi 6 and UWB

According to global technology intelligence firm ABI Research, 2022 will represent a key year for wireless connectivity innovation as Wi-Fi 6, 6E, and Ultra-Wideband adoption accelerates across a growing number of end markets. The latest wireless technologies will see strong double-digit growth as 6 GHz Wi-Fi 6E shipments triple in the next year, reaching well over 1.5 billion annual chipset shipments. Ultra-Wideband (UWB) devices are expected to reach nearly half-a-billion units as adoption increases within smartphones, wearables, speakers, personal trackers, and location tracking (RTLS) applications, forecasts ABI Research.

MediaTek Announces New Filogic 830 and Filogic 630 Wi-Fi 6/6E Chips

October 1, 2021 by audioXpress Staff

MediaTek Announces New Filogic 830 and Filogic 630 Wi-Fi 6/6E Chips

MediaTek unveiled its new Filogic connectivity family with the introduction of the Filogic 830 Wi-Fi 6/6E system-on-chip (SoC) and Filogic 630 Wi-Fi 6E network interface card (NIC) solutions. The highly integrated chipsets offer fast, reliable connectivity with enhanced performance for broadband routers, mesh systems, enterprise access points and retail routers. Two high-performance, power-efficient Wi-Fi 6/6E chipsets with high computation capabilities and a rich set of features.

Wi-Fi 6 Adoption on the Rise to Reach 81% of Total Wi-Fi CPE Market in 2026

September 9, 2021 by audioXpress Staff

Wi-Fi 6 Adoption on the Rise to Reach 81% of Total Wi-Fi CPE Market in 2026

The COVID-19 pandemic has accelerated demand for broadband services, driving 214.8 million Wi-Fi Customer Premises Equipment (CPE) unit shipments in 2020, a 5% increase from the prior year. The demand for broadband devices will continue to increase as the industry continuously moves toward better broadband access to support both home and business users, says ABI Research.

Infineon Introduces New AIROC Wi-Fi 6/6E and Bluetooth 5.2 Combo Devices for High-Quality Video and Audio Streaming

April 9, 2021 by Cristina Costa

Infineon Introduces New AIROC Wi-Fi 6/6E and Bluetooth 5.2 Combo Devices for High-Quality Video and Audio Streaming

Infineon Technologies expanded its wireless portfolio with new high-performance, reliable and secure devices. The newly developed AIROC brand now includes the industry’s first 1x1 Wi-Fi 6/6E and Bluetooth 5.2 combo SoC for enterprise and industrial applications, and its first 2x2 Wi-Fi 6/6E and Bluetooth 5.2 combo SoC for multimedia, consumer and automotive applications. The new wireless connectivity combo devices deliver robust performance and minimal latency, making them ideal for high-quality video and audio streaming applications.

Wi-Fi Alliance Expands Home Wi-Fi with Certified Solutions

February 12, 2021 by audioXpress Staff

Wi-Fi Alliance Expands Home Wi-Fi with Certified Solutions

The Wi-Fi Alliance announced that its Wi-Fi Easy Connect and Wi-Fi EasyMesh solutions will evolve to drive superior home network experiences. Wi-Fi Certified Easy Connect and Wi-Fi Certified EasyMesh now deliver more secure, smart, and efficient Wi-Fi home networks. New features available for Wi-Fi Easy Connect now enable zero touch, secure provisioning of devices onto home networks, while additions to Wi-Fi EasyMesh increase Wi-Fi network capacity, support more simultaneous services, and deliver end-to-end service prioritization.

Qualcomm Unveils Snapdragon 888 Mobile Processing Platform

December 3, 2020 by Joao Martins

Qualcomm Unveils Snapdragon 888 Mobile Processing Platform

During the annual Snapdragon Tech Summit Digital 2020, Qualcomm introduced its latest flagship Qualcomm Snapdragon 888 5G Mobile Platform, which will set the benchmark for flagship Android smartphones in 2021. This new platform packs industry-leading mobile innovations in 5G, artificial intelligence (AI), gaming, and camera technologies, while offering all the processing and connectivity power to enable next-generation immersive audio experiences, including support for Bluetooth 5.2 with LE Audio features.

«
1
2
3
»