All items tagged with research and development (45)

HEAD acoustics Releases Intuitive Structural Analysis Software Package

April 27, 2021 by audioXpress Staff

HEAD acoustics Releases Intuitive Structural Analysis Software Package

With the release of ArtemiS SUITE 12.5, HEAD acoustics introduced a complete structural analysis package, offering Time Domain Animation, Operational Deflection Shape (ODS), Shape Comparison Tool and Modal Analysis. This will allow a unified software environment for simulation and project engineers to address structural dynamic issues within the ArtemiS SUITE with ease and efficiency.

Yamaha Unveils Ambitious Immersive Audio Vision With Active Field Control Upgrade

April 22, 2021 by Joao Martins

Yamaha Unveils Ambitious Immersive Audio Vision With Active Field Control Upgrade

Following industry trends towards spatial audio content and immersive audio reproduction systems, Yamaha announced the upcoming release of a new version upgrade for its Active Field Control (AFC) processing system, together with the introduction of new acoustic enhancement (AFC Enhance) and image control (AFC Image) applications. Together, Yamaha hopes to create a complete ecosystem for immersive audio, involving all its brands and R&D capabilities.

Vesper Raises $8 Million to Expand Production and Enter New Markets

April 7, 2021 by audioXpress Staff

Vesper Raises $8 Million to Expand Production and Enter New Markets

Vesper, the pioneer in piezoelectric MEMS microphones and sensors, closed an $8M financing led by Applied Ventures, the venture capital arm of Applied Materials, the world’s largest semiconductor equipment company. Vesper also received investments from Accomplice, Amazon Alexa Fund, Bose Ventures, Sands Capital, and other undisclosed investors. The round brings Vesper's total funding to date to $65M. The funding will enable the Boston-based startup to scale the mass production of its microphones and support expanded research and development.

Ellisys Rolls Out Advanced Bluetooth 5.2 LE Audio Capture and Analysis Features

March 25, 2021 by audioXpress Staff

Ellisys Rolls Out Advanced Bluetooth 5.2 LE Audio Capture and Analysis Features

Ellisys released a broad complement of innovative features to support development of emerging Bluetooth LE Audio products, including controllers, stacks, and devices. These features, available on the company's Bluetooth protocol analysis systems, broaden support for the latest Bluetooth LE Audio specifications and deliver unique technical innovations that solve complex issues for developers.

DSP Group Opens Audio Signal Processing and AI Innovation Lab in Germany

March 15, 2021 by Joao Martins

DSP Group Opens Audio Signal Processing and AI Innovation Lab in Germany

DSP Group announced the opening of an audio innovation lab in Straubing, Germany, focused on advancing the state-of-the-art in audio signal processing and artificial intelligence (AI) for acoustic engineering. The lab is already staffed with experts, each with 20+ years of experience in the areas of voice and audio processing algorithm development and deployment, speaker non-linear processing, AI-based audio processing, active noise cancellation (ANC), and rapid prototyping and tuning.

Agreement Between DSP Concepts and Cambridge Consultants Accelerates Audio Product Development and Voice Innovation

January 8, 2021 by Joao Martins

Agreement Between DSP Concepts and Cambridge Consultants Accelerates Audio Product Development and Voice Innovation

Cambridge Consultants, part of Capgemini, and DSP Concepts, the creators of Audio Weaver, the audio DSP platform powering some of the world’s best consumer and automotive brands, announced an agreement that will see Cambridge Consultants offering deep audio product development expertise and technology to the many audio brands in the fast-growing DSP Concepts ecosystem. Cambridge Consultants will be also adding its own voice detection processing to Audio Weaver.

Klippel Announces New dB Lab 210 and QC 6.6 Audio Analyzer Software Updates

July 15, 2020 by audioXpress Staff

Klippel Announces New dB Lab 210 and QC 6.6 Audio Analyzer Software Updates

The Klippel Analyzer System has received another software update with new features for both R&D and QC applications. The updates are free of charge for any users of dB-Lab major version 210 or QC 6, respectively and provide new relevant tools for output-based testing of contemporary DSP-enhanced speakers, headphones and other audio systems according to the IEC 60268-21 standard.

Gesture-Controlled and Edge-AI In-Ear Headphones Joint Development Effort Funded in Sweden

June 3, 2020 by Joao Martins

Gesture-Controlled and Edge-AI In-Ear Headphones Joint Development Effort Funded in Sweden

Swedish companies Acconeer, Imagimob and Flexworks decided to join forces in a project to develop gesture-controlled in-ear headphones. Using the profound expertise of the three companies, the project will be a unique combination of research in advanced radar technology, expertise in AI (deep learning) and expertise in designing and manufacturing consumer electronics products. A first working prototype is expected within the first year of the project.

Pico Technology Extends Range of PC-Based Mixed Signal Oscilloscopes

May 28, 2020 by audioXpress Staff

Pico Technology Extends Range of PC-Based Mixed Signal Oscilloscopes

Pico Technology announced the further development of its PicoScope 6000E Series oscilloscopes with the launch of three new 4-channel models, each of which can be configured with 16 optional digital channels. With bandwidths of 300 or 500 MHz, 8-bit or 8/10/12-bit Flexible Resolution and up to 4 GS deep capture memory, these products enhance the existing PicoScope 6000E portfolio, adding to the 8-channel models that were introduced earlier in the year.

AAC Technologies Opens New MEMS Microphone Design Center in Scotland

May 1, 2020 by audioXpress Staff

AAC Technologies Opens New MEMS Microphone Design Center in Scotland

Expanding its commitment to invest in the build-out of a worldwide network of R&D centers that advance the technologies critical to the performance of smartphones and other mobile devices, AAC Technologies Holdings Inc., announced the opening of a MEMS microphone center in Edinburgh, Scotland. The new facility, focused on the design of next generation microphone system-level solutions, joins a growing worldwide network of R&D centers located in China, Denmark, Finland, Hong Kong, Japan, Singapore and the United States.

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