All items tagged with product development (968)

AES New York 2017’s Product Development Track to Feature the Industry’s Newest Advancements in Audio Technology and Methods

August 28, 2017 by Audio Engineering_Society

AES New York 2017’s Product Development Track to Feature the Industry’s Newest Advancements in Audio Technology and Methods

The 143rd International Audio Engineering Society (AES) Convention, at the Jacob Javits Center, NY, October 18 to 21, will be the must-attend meeting place and gear exhibition for audio professionals. The AES New York 2017’s Product Development Track will feature the industry’s newest advancements in audio technology and methods. The seminar series will address methods of bringing products to market faster, new headphone design techniques, development methods, better audio coding methods, and more.

ANSYS 18.2 Release Enhances Simulation Speed and Accuracy

August 24, 2017 by audioXpress Staff

ANSYS 18.2 Release Enhances Simulation Speed and Accuracy

ANSYS continues to expand upon its products and platform, and deliver on the Pervasive Engineering Simulation vision, with its latest release of ANSYS 18.2. This update brings increased levels of accuracy, speed and ease-of-use – spurring more engineers to use simulation across every stage of the product lifecycle to design cutting-edge products more efficiently and economically.

DSP Group and LISNR Partner to Create Ultra-low Power Audio-Enabled Data Transmission Solution

August 22, 2017 by audioXpress Staff

DSP Group and LISNR Partner to Create Ultra-low Power Audio-Enabled Data Transmission Solution

Wireless communications chipset specialist, DSP Group and LISNR, a global provider of data-over-audio technology, developed the Audio-D, a solution that supports data-over-audio communication for any device with a speaker or microphone. This solution, based on DSP Group’s DBMD4 Voice SoC and LISNR technology, overcomes device-to-device hardware restraints regarding RF protocols. This enables always-on communication and high level of interoperability while consuming low power.

Microchip Unveils Next-Generation MPLAB ICD 4 In-Circuit Debugger with Faster Processor and Increased RAM

August 17, 2017 by audioXpress Staff

Microchip Unveils Next-Generation MPLAB ICD 4 In-Circuit Debugger with Faster Processor and Increased RAM

Microchip unveiled its next-generation In-Circuit Debugger (ICD), in-circuit programming and debugging development tool. The new MPLAB ICD 4 features a faster processor and increased RAM, achieving up to twice the speed of the previous generation ICD. The new ICD 4 offers a wider voltage range of 1.20 to 5.5V and increased flexibility, supporting all PIC microcontrollers (MCUs) and dsPIC digital signal controllers via MPLAB X IDE.

Qualcomm Adds Support for DTS Virtual:X Technology on MAPX Audio System-on-Chip Platform

August 10, 2017 by audioXpress Staff

Qualcomm Adds Support for DTS Virtual:X Technology on MAPX Audio System-on-Chip Platform

Qualcomm announced that its MAPX audio SoC family now supports DTS Virtual:X immersive sound post processing. This next-generation technology is designed to translate any input source, from stereo to 11.1-channel content, into a format that can play back on a traditional 5.1, 3.1 or 2.1 speaker setup, including soundbars, which help deliver a compelling immersive listening experience for consumers without the need for height speakers.

Acroname Announces First Programmable USB Type-C Switch

August 8, 2017 by Cristina Costa

Acroname Announces First Programmable USB Type-C Switch

Acroname, a leading producer of embedded automation and manufacturing test platforms, has announced the launch of the USB-C-Switch, a 4-channel, programmable, USB 3.2 multiplexing switch, optimized for USB Type-C applications in manufacturing and development environments. “With USB-C-Switch in Acroname’s product family, test engineers will now have tools to manage the very latest features of USB,” the company says.

Nordic Semiconductor Releases Bluetooth 5 Pre-Qualified, Production-Ready Development Solution

August 3, 2017 by audioXpress Staff

Nordic Semiconductor Releases Bluetooth 5 Pre-Qualified, Production-Ready Development Solution

Nordic Semiconductor released its Bluetooth 5 pre-qualified, production-ready development solution for building Bluetooth 5 qualified products using the company's nRF52832 SoC. The solution combines production-ready Bluetooth 5 software - S132 v5.0 SoftDevice and nRF5 SDK v14.0 - enabling developers to design high performance Bluetooth 5-ready products, taking advantage of increased throughput, longer range, advertising extensions and increased broadcast capacity and co-existence.

B&K Precision Extends Programmable AC Power Sources up to 3000VA

August 3, 2017 by audioXpress Staff

B&K Precision Extends Programmable AC Power Sources up to 3000VA

B&K Precision announced a new line of AC power sources that deliver up to 3000VA, principally for product designs that depend on grid power anywhere in the world. In addition to a boost in range from the company's previous line of 1500VA instruments, the new power sources can also serve as a power source for DC and AC+DC product development, and feature amplifier mode to handle complex waveforms. They also can simulate surges and sags, as well as waveform distortions and noise, features that typically come in more-expensive instruments.

Microchip Launches New SAM Microcontroller 32-bit Families with Extensive Connectivity Interface Options

August 2, 2017 by audioXpress Staff

Microchip Launches New SAM Microcontroller 32-bit Families with Extensive Connectivity Interface Options

Microchip just announced its new SAM D5x and E5x MCUs that provide powerful performance and enhanced security features, combining the performance of an ARM Cortex-M4 processor with a Floating Point Unit (FPU). The SAM D5x and SAM E5x 32-bit MCU families offer extensive connectivity interfaces, powerful performance and robust hardware-based security for a wide variety of applications.

Cadence Announces Tensilica HiFi 3z DSP Architecture with Enhanced Voice and Audio Processing Performance

July 27, 2017 by audioXpress Staff

Cadence Announces Tensilica HiFi 3z DSP Architecture with Enhanced Voice and Audio Processing Performance

Cadence Design Systems, announced the Cadence Tensilica HiFi 3z DSP IP core for system-on-chip (SoC) designs targeted for the latest mobile and home entertainment applications, including smartphones, augmented reality (AR)/3D goggles, digital TVs and set-top boxes (STBs). The new HiFi 3z architecture offers more than 1.3X better voice and audio processing performance than its predecessor, the HiFi 3 DSP, which leads the industry in the number of audio DSP cores shipped.

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