All items tagged with product development (968)
Alpha and Omega Semiconductor Announces Type-C Power Delivery Input Protection Switch With True Reverse Blocking
July 24, 2018 by Cristina Costa

Alpha and Omega Semiconductor Announces Type-C Power Delivery Input Protection Switch With True Reverse Blocking

Alpha and Omega Semiconductor, a global supplier of a broad range of power semiconductors and power ICs, announced a new Type-C Power Delivery compliant input protection switch with up to 28V over-voltage protection. The AOZ1376 is a smart protection switch with reverse current blocking capability intended for applications where internal circuitry requires protection from exposure to high voltages.
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R&D Stories: Engineering Voice-Enabled Smart Gadgets
July 18, 2018 by Ofer Elyakim

R&D Stories: Engineering Voice-Enabled Smart Gadgets

The first step companies face in enabling a voice user interface (VUI) experience is to decide whether to partner with a current market offering or to build a proprietary voice solution, which requires a significant amount of resources. In this article, Ofer Elyakim (Chief Executive Officer, DSP Group) offers an overview of DSP Group’s experience in enabling voice in a variety of new consumer electronics devices, using its open audio/voice DSP platform. This article was originally published in audioxpress, June 2018.
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Knowles Announces SmartMic Headset Development Kit for Baidu DuerOS
July 12, 2018 by audioXpress Staff

Knowles Announces SmartMic Headset Development Kit for Baidu DuerOS

Knowles Corporation announced that it has developed with Baidu and Bestechnic (BES) a new hands-free reference design for headphones, headsets and true wireless earbuds that works with smart devices powered by DuerOS, Baidu’s conversational AI system. The Knowles IA610 SmartMic supports the industry’s lowest-power, always-on voice wake capability to enable Baidu voice service on-the-go for ear worn consumer products.
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Bosch Sensortec Launches New Generation of Smart Sensor Hubs for Hearables
July 9, 2018 by audioXpress Staff

Bosch Sensortec Launches New Generation of Smart Sensor Hubs for Hearables

During the Sensors Expo (June 27-28) in San Jose, California, Bosch Sensortec announced the BHI260 and BHA260, the first two members of a new generation of smart sensor hubs. These new devices are optimized for 24/7, always-on sensor processing and feature ultra-low power consumption, and a high performance co-processor, ideal for the development of new wearables, hearables, AR/VR and other mobile devices and battery-operated devices.
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Cypress Introduces First 7-Port USB-C Hub Controller With USB Power Delivery
July 2, 2018 by Cristina Costa

Cypress Introduces First 7-Port USB-C Hub Controller With USB Power Delivery

Cypress Semiconductor announced the industry’s first 7-port USB-C hub controller with USB Power Delivery (PD). The programmable EZ-USB HX3PD hub controller simplifies USB-C dock system designs by integrating the functionality of five chips into one, lowering bill-of-materials (BOM) and reducing board size by as much as 50%. The highly-integrated controller is ideal for notebook and tablet docking stations, monitor docks and multi-function USB-C peripherals.
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New Qualcomm QCC3026 Bluetooth Audio System-on-Chip Now Available
June 29, 2018 by audioXpress Staff

New Qualcomm QCC3026 Bluetooth Audio System-on-Chip Now Available

Qualcomm announced the QCC3026, a flash-programmable Bluetooth Audio System-on-Chip (SoC) that is designed to reduce power consumption by up to 50% compared to previous generation entry-level flash devices. The new SoC is also engineered to help manufacturers simply and quickly develop and commercialize feature optimized truly wireless headsets, and extends the Company’s portfolio of low power Bluetooth audio solutions following the announcement of the flagship QCC5100 Bluetooth SoC series earlier this year.
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DSP Group Announces Ultra-Low-Power Development Kit with Far-Field Speech Accuracy for Amazon Alexa Voice Service
June 29, 2018 by audioXpress Staff

DSP Group Announces Ultra-Low-Power Development Kit with Far-Field Speech Accuracy for Amazon Alexa Voice Service

Wireless communications chipset solutions specialists DSP Group announced the availability of its HDClear 3-Microphone Development Kit for Amazon Alexa Voice Service (AVS). This Alexa certified solution features DBMD5, DSP Group’s advanced audio/voice processor, and its best-in-class HDClear voice enhancement processing technology, creating a complete development platform for low-power applications, including smart speakers, wearable computing devices, smart home devices and remote controls.
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Aaware and Infineon Form Partnership to Develop Next-Generation Voice Solutions
June 27, 2018 by audioXpress Staff

Aaware and Infineon Form Partnership to Develop Next-Generation Voice Solutions

Infineon Technologies, and Aaware, Inc., an emerging supplier of sound capture technology for far-field, voice-enabled digital products, announced the formation of a partnership to launch a next-generation voice development platform to be released later this summer. Aaware’s Acoustically Aware technology is highly synergistic with Infineon’s digital MEMS microphone technology, combining to bring the best sound capture for extremely noisy environments in commercial and industrial applications.
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Microchip Announces First 32-bit Low-Power MCU to Feature Robust, Chip-Level Security and Arm TrustZone Technology
June 26, 2018 by audioXpress Staff

Microchip Announces First 32-bit Low-Power MCU to Feature Robust, Chip-Level Security and Arm TrustZone Technology

Microchip announced the 32-bit SAM L10/L11 MCU families for low power and high security, based on the Arm Cortex-M23 core, with the SAM L11 featuring Arm TrustZone for Armv8-M, a programmable environment that provides hardware isolation between certified libraries, IP and application code. The SAM L11 features robust security with chip-level tamper resistance, secure boot and secure key storage. When combined with TrustZone technology, this is designed to protect applications from both remote and physical attacks.
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Fraunhofer’s xHE-AAC Audio Codec Software Extends Native AAC Support In Android P For Better Quality At Low Bitrates
June 11, 2018 by Joao Martins

Fraunhofer’s xHE-AAC Audio Codec Software Extends Native AAC Support In Android P For Better Quality At Low Bitrates

With the release of the Android P beta 3 preview, Fraunhofer IIS announces a new version of the popular FDK library which has been a part of Android since 2012. The FDK2 version will bring several new technologies to Android OEMs, service providers and developers, including xHE-AAC for video and music delivery down to 12kbit/s for stereo sound and MPEG-D DRC dynamic range control for better listening in noisy environments. An important update for a very fragmented platform.
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