All items tagged with product development (968)
Chirp and DSP Group Unveil Reference Design for Sound-Based Data Transmission
October 14, 2019 by audioXpress Staff

Chirp and DSP Group Unveil Reference Design for Sound-Based Data Transmission

Chirp, the pioneer of data-over-sound technology, and DSP Group, the specialist in wireless chipsets for smart-enabled devices, announced a turnkey solution leveraging embedded data-over-sound to improve user experiences with enhanced provisioning for consumer applications. The design kit combines Chirp’s ultrasonic signaling protocol for smart-enabled devices with DSP Group’s SmartVoice technology to allow connectivity between nearby devices without requiring any set up, pairing, or configuration.
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The NXP NXH3670 Enables Ideal Wireless Headset Experiences
October 10, 2019 by Special Content

The NXP NXH3670 Enables Ideal Wireless Headset Experiences

Inspired by a wish to enhance gaming audio, NXP Semiconductors designed a single-chip, high performance wireless audio streaming solution. The NxH3670 constitutes a highly integrated, single-chip ultra-low-power wireless transceiver with embedded MCU, targeted at wireless audio streaming for gaming headsets at very low latency. Check out NXP’s proprietary ultra-low power, 2.4 GHz wireless gaming headphone solution. Sponsored Content by NXP Semiconductors.
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Skyworks Connectivity Modules Powering Next Generation Wi-Fi 6 Applications
October 10, 2019 by audioXpress Staff

Skyworks Connectivity Modules Powering Next Generation Wi-Fi 6 Applications

Skyworks Solutions announced that its advanced connectivity solutions are powering next generation Wi-Fi 6 (802.11ax) devices from the world’s leading connected home and mesh network providers, including Arris, Asus, D-Link, Netgear, Ruckus and TP-Link. Specifically, Skyworks’ modules are being leveraged in all of the latest best-selling Wi-Fi 6 routers.
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Updating the Rules on Amplifier Metrics
October 9, 2019 by Jens Tybo Jensen

Updating the Rules on Amplifier Metrics

This article shares a new important insight on modern Class-D amplification from the experienced perspective of Jens Tybo Jensen - part of the founding team at Merus Audio, and now head of Class D Audio Marketing and Applications at Infineon. The author states that it may be time to rethink Class D audio design and measurement practices, and he details what multilevel Class D amplification can do for new product designs. This article was originally published in audioXpress, October 2019.
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Microchip Introduces New Bluetooth 5.0-Qualified, Dual-Mode Audio IC and Certified Module with LDAC Codec Support
October 8, 2019 by Joao Martins

Microchip Introduces New Bluetooth 5.0-Qualified, Dual-Mode Audio IC and Certified Module with LDAC Codec Support

Microchip introduced the new BM83 SoC, a Bluetooth 5.0 certified dual-mode audio module that contains an on-board Bluetooth stack and audio profiles and supports 24-bit/96kHz high-resolution audio formats to enable high-fidelity wireless audio, including support for Sony’s high fidelity LDAC codec. The combined solution is intended for both new speaker and headphone designs, offering differentiated features.
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NXP Announces New Dual-Core Arm Cortex-M Based GHz Crossover Microcontroller for Advanced Machine Learning Applications
October 4, 2019 by audioXpress Staff

NXP Announces New Dual-Core Arm Cortex-M Based GHz Crossover Microcontroller for Advanced Machine Learning Applications

NXP Semiconductors announced the i.MX RT1170 family of crossover MCUs that combines unprecedented levels of performance, reliability, and integration to propel industrial, automotive and consumer machine learning applications. The NXP i.MX RT1170 family reinforces NXP’s commitment to advance edge computing with its EdgeVerse portfolio of solutions and marks a technology breakthrough with MCUs that run up to 1GHz while maintaining low-power efficiency.
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TDK Announces Availability of the Chirp SmartSonic Platform Family of MEMS-based Ultrasonic ToF Sensors
October 4, 2019 by Cristina Costa

TDK Announces Availability of the Chirp SmartSonic Platform Family of MEMS-based Ultrasonic ToF Sensors

Following its acquisition of Chirp Microsystems in February 2018, TDK Corporation now announced the immediate availability of the latest Chirp SmartSonic platform family of ultrasonic sensor time-of-flight (ToF) solutions. The SmartSonic platform is currently available with the Chirp CH-101, an ultra-low power ultrasonic ToF range sensor that provides millimeter-accurate range measurements up to 1.2m, independent of target color and transparency.
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Dirac and RHA Announce Commitment to Explore Next-Generation of Headphone Sound
September 26, 2019 by audioXpress Staff

Dirac and RHA Announce Commitment to Explore Next-Generation of Headphone Sound

Sound processing pioneer Dirac announced a commercial agreement with RHA to explore the integration of Dirac’s latest audio algorithms into the British manufacturer's headphones. According to the Swedish company, "the collaboration with RHA marks an important step for Dirac as it establishes itself as a global leader in digital sound optimization solutions for the headphone market – as it has for the luxury automotive, home theater, and mobile markets." RHA says this relationship with Dirac reinforces the company’s mission to deliver the best possible audio quality.
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Orchard Audio Launches Kickstarter Campaign for BOSC Monoblock GaN Audio Amplifier
September 24, 2019 by audioXpress Staff

Orchard Audio Launches Kickstarter Campaign for BOSC Monoblock GaN Audio Amplifier

There is a very interesting new audio project being promoted on Kickstarter. Coming from Orchard Audio, the BOSC is a well engineered hi-fi monoblock audio amplifier that explores the latest gallium nitride (GaN) semiconductor technology to achieve ultra-high performance in a small package. This compact and affordable 150 watt amplifier shows a lot of potential, with an impressive circuit design and high-quality sound, and is available in 3-4Ω (13.8dB gain) or 6-8Ω (16.8dB gain) versions.
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DSP Concepts TalkTo Audio Voice Capture Technology Enables New Exciting Products at IFA 2019
September 11, 2019 by audioXpress Staff

DSP Concepts TalkTo Audio Voice Capture Technology Enables New Exciting Products at IFA 2019

Audio processing embedded software provider DSP Concepts announced that it has delivered the industry’s most advanced voice user interface and audio playback technology, resulting in Braun Audio shipping the industry’s first multichannel product with hands-free, far-field voice control for Google Assistant. As anticipated, Braun’s return to the premium audio market was recently confirmed at IFA 2019, resulting from a collaboration with DSP Concepts, Pure, StreamUnlimited, and Karl-Heinz Fink.
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