All items tagged with product development (968)

Lyceum Introduces Advanced Data Ingestor for Audio Measurement Data Management and Collaboration

April 27, 2023 by Joao Martins

Lyceum Introduces Advanced Data Ingestor for Audio Measurement Data Management and Collaboration

Lyceum unveiled the Advanced Data Ingestor, a solution designed to streamline audio measurement data management and collaboration. This tool automates repetitive data cleaning tasks and provides a cloud-based platform for sharing 'clean' data, significantly reducing the time-consuming process that engineers have faced for years. The solution facilitates real-time collaboration between manufacturers and product lead engineering teams, allowing for quicker issue identification and resolution.

HEM Introduces New Ferrum WANDLA Flagship DAC/Preamp

April 25, 2023 by audioXpress Staff

HEM Introduces New Ferrum WANDLA Flagship DAC/Preamp

Polish audio manufacturer HEM continues to introduce new high-end audio products under its brand Ferrum. First it launched the HYPSOS hybrid power system, followed by the OOR headphone amplifier, and the ERCO USB-C DAC with headphone preamp, establishing a new reference in quality and price for a desktop high end design. Now, the company introduced the new WANDLA, a flagship DA converter that can also be powered by the HYPSOS.

Practical Test & Measurement: The Proof Is in the Testing

April 18, 2023 by Adran Lara Moreno and Christian Bellmann

Practical Test & Measurement: The Proof Is in the Testing

The Klippel Near Field Scanner System (NFS) was used for the critical testing and measurement of Holoplot's X1 Matrix Array compensation algorithm capabilities. All our readers who have appreciated the story of the development of the unique Holoplot technology, published in the September 2022 issue of audioXpress, will enjoy reading about how Klippel and Holoplot worked to overcome frequency absorption and gain reduction challenges that resulted from the need to conceal the X1 systems behind an acoustically semi-transparent projection panel.

ESS Technology Releases New 2 Channel High Performance Audio ES9826 SABRE ADC With Integrated PGA

April 14, 2023 by Cristina Costa

ESS Technology Releases New 2 Channel High Performance Audio ES9826 SABRE ADC With Integrated PGA

ESS Technology released its new 2 channel ES9826 SABRE Analog-to-Digital Converter (ADC). The new device combines effectively two integrated ADC circuits which use ESS’ patented Hyperstream IV ADC architecture, and a front-end PGA. Together, the new SABRE ADC device delivers high quality audio with a DNR of +123dB and a THD+N of -105dB, setting another industry benchmark for the company in terms of audio performance, features, and cost effectiveness.

Knowles Releases High-Performance Digital Voice Vibration Sensor for High-Fidelity Voice Pick-Up in TWS

April 4, 2023 by audioXpress Staff

Knowles Releases High-Performance Digital Voice Vibration Sensor for High-Fidelity Voice Pick-Up in TWS

Knowles released a low power, high bandwidth, specialized vibration sensor that can be used to filter background noise and create reliable, high-quality voice calling in noisy environments. The Knowles V2S200D Digital Voice Vibration Sensor, the first-of-its-kind for the brand works in conjunction with microphones to improve voice signal pick-up in True Wireless Stereo (TWS) earbuds.

Modern PCB Design Practices: Part 2 — Tips and Techniques

April 1, 2023 by Ethan Winer

Modern PCB Design Practices: Part 2 — Tips and Techniques

The first article from audio expert Ethan Winer about Modern PCB Design Practices, gave a general overview of board design using surface-mounted devices (SMDs). The article examines current practices and methods for designing four-layer printed circuit boards using surface mounted components (SMDs), and this second part explains specific strategies and related issues to deal with the design and production of great quality PCBs. This article was originally published in audioXpress, March 2023.

New Renesas RISC-V Voice-Control ASSP Allows Differentiated Applications with Voice Recognition

March 31, 2023 by Cristina Costa

New Renesas RISC-V Voice-Control ASSP Allows Differentiated Applications with Voice Recognition

Renesas extended its RISC-V embedded processing portfolio with the first RISC-V MCU designed for voice-controlled HMI (human-machine interface) systems. The new R9A06G150 32-bit ASSP (Application Specific Signal Processor), developed in collaboration with RISC-V ecosystem partners, provides a complete, cost-effective, production-ready voice-control system solution that eliminates the need for RISC-V tools and upfront software investment.

Modern PCB Design Practices: Part 1 — An Overview of the Process

March 22, 2023 by Ethan Winer

Modern PCB Design Practices: Part 1 — An Overview of the Process

In this two-part series, Ethan Winer examines current practices and methods for designing four-layer printed circuit boards using surface-mounted components (SMDs). A great article for our DIY readers and many developers who often are faced with the need to build and test their projects on a properly designed, prototype printed circuit board. Part 1 presents an overview of the process, while Part 2 he will explain specific strategies. Many related issues will be described along the way.

ESS Technology Introduces ES9069Q & ES9039Q2M 2-Channel Digital-to-Analog Converters

March 21, 2023 by Joao Martins

ESS Technology Introduces ES9069Q & ES9039Q2M 2-Channel Digital-to-Analog Converters

ESS Technology introduced two new SABRE Series high performance Digital-to-Analog 2-channel converters targeting applications that require outstanding stereo performance. According to the semiconductor company, the new ES9069Q and ES9039Q2M SABRE DACs continue to set the benchmark in ultra-low noise digital conversion with a dynamic range (DNR) of +130dB and -120dB THD+N per channel.

STMicroelectronics Simplifies Wireless Product Development With Certified STM32WB1MMC Bluetooth LE Module

March 16, 2023 by audioXpress Staff

STMicroelectronics Simplifies Wireless Product Development With Certified STM32WB1MMC Bluetooth LE Module

The new STM32 Bluetooth wireless module from STMicroelectronics lets designers access the advantages of ST’s dual core STM32WB microcontrollers (MCUs), especially in projects intended for low-to-medium production volumes. The module simplifies development and accelerates time to market, combining Bluetooth Low Energy 5.3 certification and worldwide radio-equipment approvals with the STM32Cube ecosystem support.

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