STMicroelectronics, DSP Group, and Sensory Create Keyword-Smart Microphone for Voice-Controlled Devices

Top MEMS supplier STMicroelectronics, DSP Group, and Sensory, a leading technology provider of voice interface and keyword-detect algorithms, have revealed details for a highly power-efficient, voice-detecting and -processing microphone that delivers keyword-recognition capabilities in a compact package. Ultra-low power voice processing and MEMS microphone circuitry enables sound detection and keyword recognition in a miniaturized single package.

Cadence Design Systems and Waves Audio announced the availability of the Waves Nx Virtual Reality Audio Technology on the Cadence Tensilica HiFi 3 DSP for Audio, Voice, and Speech. The Waves Nx solution, which delivers high-quality VR audio and true 5.1 or 7.1 surround with a minimal resource footprint, will be demonstrated at the Cadence booth at Mobile World Congress in Barcelona, February 27 to March 2, 2017, in Hall 6, Stand 6L36.

CEVA DSP, a licensor of signal processing IP for smarter, connected devices, announced that Shenzhen Micro & Nano Institute (MNI) has licensed the CEVA audio/voice DSP for the development of a multi-mic voice processor targeting a range of intelligent hardware systems including robots, smart appliances and the smart home. CEVA DSP's will power MNI’s 360 degree voice positioning algorithm in their intelligent voice processor.

Conexant’s new CX20924 is a 4 microphone far-field voice input DSP featuring the company’s new Smart Source Locator technology. The new DSP introduces superior 360-degree voice location capabilities and excellent speech recognition hit rates to smart voice applications. As part of Conexant’s Contextual Awareness product portfolio, it offers a highly accurate, robust way to control smart speakers, robots, security monitoring cameras and more.