TDK Launches VibeSense360 Next-Generation TWS Motion Sensor Solution

During CES 2025, TDK announced an enhanced next-generation InvenSense VibeSense360 motion sensor solution that will enable state-of-the-art spatial audio head tracking in new true wireless earbuds. The new VibeSense360 TWS solution includes motion sensor software, running on the latest SmartMotion ICM-45606 inertial measurement unit (IMU) that enables concurrent features of spatial audio, keyword assist, transparency for talk, head/UI gestures, and machine learning. The 220µA @50Hz 6-Axis IMU delivers industry-leading performance and battery life for TWS applications.

DSP Concepts, the audio platform powering more than 50M devices for many of the world’s best consumer and automotive brands, announced a partnership with CloudNav to bring its sensor fusion technology to Audio Weaver. This means that developers can seamlessly deploy CloudNav’s Performance Fusion technology through Audio Weaver’s drag-and-drop graphical interface to integrate and automatically calibrate inertial sensors for optimal product performance.