TDK Announces Availability of the Chirp SmartSonic Platform Family of MEMS-based Ultrasonic ToF Sensors

Following its acquisition of Chirp Microsystems in February 2018, TDK Corporation now announced the immediate availability of the latest Chirp SmartSonic platform family of ultrasonic sensor time-of-flight (ToF) solutions. The SmartSonic platform is currently available with the Chirp CH-101, an ultra-low power ultrasonic ToF range sensor that provides millimeter-accurate range measurements up to 1.2m, independent of target color and transparency.

TDK Corporation announced that it has reached an agreement with Chirp Microsystems, a pioneer in high-performance ultrasonic sensing, headquartered in Berkeley, California. With the acquisition, Chirp becomes a wholly owned subsidiary of TDK, enhancing its existing technology in fingerprint sensors, MEMS sensors, and Piezoelectric transducer product lines. “TDK aims to be the leader in the ultrasonic MEMS sensors and solutions market,” says Shigenao Ishiguro, TDK’s President and CEO.