All items tagged with SoC (143)

NXP Brings Dolby Atmos and DTS:X to the Masses with its New Immersiv3D Audio Solution

February 18, 2019 by audioXpress Staff

NXP Brings Dolby Atmos and DTS:X to the Masses with its New Immersiv3D Audio Solution

Following a showcase at CES 2019, NXP Semiconductors announced its Immersiv3D audio solution, combining NXP software on its i.MX 8M Mini applications processor with support both Dolby Atmos and DTS:X immersive audio technologies. The i.MX 8M Mini SoC also brings smart capabilities like voice control to a broader range of consumer devices including soundbars, smart speakers, and AV receivers with the option for adding additional speakers to distribute smart voice control and immersive audio throughout the home.

Optek Selects Cadence Tensilica HiFi 3 DSP for Bluetooth 5 Dual-Mode Audio/Voice SoC

January 17, 2019 by audioXpress Staff

Optek Selects Cadence Tensilica HiFi 3 DSP for Bluetooth 5 Dual-Mode Audio/Voice SoC

Cadence Design Systems announced that Optek has selected the Cadence Tensilica HiFi 3 DSP for its latest OTK528X Bluetooth 5 dual-mode audio/voice system on chip (SoC). Optek’s customers can now take advantage of the HiFi DSP ecosystem for optimized audio, voice and artificial intelligence (AI) speech-based recognition processing software utilized in applications including hearables, wireless speakers, soundbars, on/in ear headphones, multi-channel AVRs, musical instruments, and voice user interface (VUI) devices.

Optek Licenses and Deploys CEVA Bluetooth IP for Next-Generation Bluetooth 5 Wireless Audio Applications

January 2, 2019 by audioXpress Staff

Optek Licenses and Deploys CEVA Bluetooth IP for Next-Generation Bluetooth 5 Wireless Audio Applications

CEVA, a leading licensor of signal processing platforms and artificial intelligence processors for connected devices, announced that Optek Digital Technology, a fabless semiconductor company of advanced multimedia SoCs, has licensed and deployed CEVA’s RivieraWaves Bluetooth 5 Dual Mode IP in its latest OTK528X multimedia System-on-Chip (SoC), targeting artificial intelligence (AI), voice and music market segments and applications including hearables, wireless speakers, on/in ear headphone, multi-channel AVR, musical instruments and voice user interface (VUI).

ResearchAndMarkets.com Publishes Bluetooth 5: System-on-Chip Comparisons 2018 - Complete Teardown Report

November 6, 2018 by audioXpress Staff

ResearchAndMarkets.com Publishes Bluetooth 5: System-on-Chip Comparisons 2018 - Complete Teardown Report

The "Bluetooth 5: System-on-Chip Comparison 2018 Complete Teardown Report" report has just been added to ResearchAndMarkets.com's offering. The report presents a technological and economical comparison of four of the newest and most competitive systems-on-chips (SoCs) available on the market today from four different manufacturers. They are: the QN9080 from NXP; the QCC5121 from Qualcomm; the DA14585 from Dialog Semiconductor; and the nRF52810 from Nordic Semiconductor.

Atmosic Technologies Introduces Innovative Bluetooth 5 Solution for Very Low-Power Wireless Devices

October 24, 2018 by Cristina Costa

Atmosic Technologies Introduces Innovative Bluetooth 5 Solution for Very Low-Power Wireless Devices

Atmosic Technologies, a startup company from Saratoga, California, announced what the company claims to be the industry’s lowest power wireless Bluetooth 5 platform, allowing manufacturers to deliver extended battery life and battery-free connected devices. Atmosic's inaugural M2 and M3 series SoC's will be able to power all sorts of low-power designs and deliver energy harvesting for connected devices.

STMicroelectronics Combines NFC Controller, Secure Element, and eSIM in a Single-Chip

September 28, 2018 by Joao Martins

STMicroelectronics Combines NFC Controller, Secure Element, and eSIM in a Single-Chip

STMicroelectronics revealed its highly integrated mobile-security solution, the ST54J, a system-on-chip (SoC) containing an NFC (Near-Field Communication) controller, Secure Element, and eSIM. The SoC delivers performance-boosting integration for mobile and IoT devices, with the added benefit of ST's software-partner ecosystem for smoother user experiences in mobile payments and e-ticketing transactions, as well as more convenient, remote, mobile provisioning to support multiple operator subscriptions.

Mavin Introduces Air-X True Wireless Earbuds with 10 Hour Battery Life and 100ft Connection Based on Qualcomm QCC3026 Platform

September 24, 2018 by audioXpress Staff

Mavin Introduces Air-X True Wireless Earbuds with 10 Hour Battery Life and 100ft Connection Based on Qualcomm QCC3026 Platform

Mavin, a Californian brand of wireless and digital audio solutions, announced the Air-X true wireless earbuds, , which claims to be the first to last 10-hours with one standalone charge, and up to 50 hours with its included charging case. The brand, winners of the German iF Design Award, the Red Dot Design Award and the CES Innovation Product Design Award, implemented Qualcomm’s latest chipset for premium wireless headphones. Air-X is available on Indiegogo with Super Early Bird specials starting at $99 (44% off regular price of $179).

Dialog Semiconductor Demonstrates Bluetooth Low Energy True Wireless Stereo Solution at Bluetooth World 2018

September 19, 2018 by audioXpress Staff

Dialog Semiconductor Demonstrates Bluetooth Low Energy True Wireless Stereo Solution at Bluetooth World 2018

Claiming an industry-first technology to address the challenges associated with power consumption in true wireless stereo systems, Dialog Semiconductor introduced an audio over Bluetooth low energy proof of concept running on its widely adopted SmartBond SoC’s, the first implementation to solely make use of Bluetooth low energy. This technology, which Dialog is unveiling at Bluetooth World 2018 (September 18-19) in Santa Clara, allows for best-in-class audio synchronization between left and right channels, and addresses the challenges associated with power consumption.

ON Semiconductor Expands Bluetooth 5 Radio Family with System-in-Package (SiP) Module for Easier Development of Smart Connected Applications

September 13, 2018 by audioXpress Staff

ON Semiconductor Expands Bluetooth 5 Radio Family with System-in-Package (SiP) Module for Easier Development of Smart Connected Applications

ON Semiconductor has extended its RSL10 family of Bluetooth 5 certified radio System-on-Chips (SoCs) with a ready-to-use 6 x 8 x1.46 mm System-in-Package (SiP) module. Supporting Bluetooth low energy wireless profiles and the lowest power BLE SiP from the company, RSL10 devices can be easily designed into any connected application including wearables, smart locks and appliances. The Bluetooth Certified and EEMBC ULPMark validated solution features integrated antenna for accelerated design and market introduction.

Frontier Collaborates with NXP on new Smart IoT Software Licensing Business

August 30, 2018 by Joao Martins

Frontier Collaborates with NXP on new Smart IoT Software Licensing Business

Frontier Smart Technologies, the digital audio solutions development company, announced the launch of a new Smart IoT software licensing and services business line. The first collaborator in this venture is leading silicon manufacturer, NXP Semiconductors. Frontier’s SmartSDK is a mature starting point for the development of reliable and sophisticated networked devices and can be deployed in a range of IoT systems including smart audio, home automation, smart appliances and security.

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