All items tagged with NXP Semiconductors (70)

Dirac and NXP Announce Collaboration to Support i.MX 8M Chipset Family with Premium Digital Audio

January 13, 2020 by audioXpress Staff

Dirac and NXP Announce Collaboration to Support i.MX 8M Chipset Family with Premium Digital Audio

Swedish sound pioneer Dirac and NXP Semiconductors announced a collaboration to combine one of the world’s most powerful audio chipsets with a market-leading digital audio platform. By equipping the NXP i.MX 8M family of chipsets with Dirac’s digital audio platform, OEMs can enable their devices with maximized, immersive, and adaptive sound across their complete range of products. The strategic partnership announcement was made at CES 2020.

Avnet Unveils MaaXBoard for Low-Cost Embedded Computing and Edge AI Development

November 14, 2019 by Cristina Costa

Avnet Unveils MaaXBoard for Low-Cost Embedded Computing and Edge AI Development

Avnet is now offering a single board computer which allows developers to focus more on the software side of their projects. The new MaaXBoard is a low-cost, production-ready qualified platform, based on the NXP i.MX 8M applications processor, ideal for embedded computing and applications that leverage AI at the edge. It supports design engineers and end-users seeking to create automation, multimedia, AI and smart home applications with reduced cost and time-to-market.

Alango Far-Field Voice Enhancement Package Now Available on NXP RT600 Processor

November 13, 2019 by audioXpress Staff

Alango Far-Field Voice Enhancement Package Now Available on NXP RT600 Processor

DSP processing software specialist firm, Alango has been working to port the company's Voice Enhancement Package (VEP) to the NXP i.MX RT600 cross-over processor family, which is optimized for 32-bit immersive audio applications combining a high-performance Cadence Tensilica Hi-Fi 4 audio DSP core with a next-generation Cortex-M33 core. VEP is a set of Alango proprietary far-field voice enhancement technologies developed to improve human to machine interaction in a variety of applications.

The NXP NXH3670 Enables Ideal Wireless Headset Experiences

October 10, 2019 by Special Content

The NXP NXH3670 Enables Ideal Wireless Headset Experiences

Inspired by a wish to enhance gaming audio, NXP Semiconductors designed a single-chip, high performance wireless audio streaming solution. The NxH3670 constitutes a highly integrated, single-chip ultra-low-power wireless transceiver with embedded MCU, targeted at wireless audio streaming for gaming headsets at very low latency. Check out NXP’s proprietary ultra-low power, 2.4 GHz wireless gaming headphone solution. Sponsored Content by NXP Semiconductors.

NXP Announces New Dual-Core Arm Cortex-M Based GHz Crossover Microcontroller for Advanced Machine Learning Applications

October 4, 2019 by audioXpress Staff

NXP Announces New Dual-Core Arm Cortex-M Based GHz Crossover Microcontroller for Advanced Machine Learning Applications

NXP Semiconductors announced the i.MX RT1170 family of crossover MCUs that combines unprecedented levels of performance, reliability, and integration to propel industrial, automotive and consumer machine learning applications. The NXP i.MX RT1170 family reinforces NXP’s commitment to advance edge computing with its EdgeVerse portfolio of solutions and marks a technology breakthrough with MCUs that run up to 1GHz while maintaining low-power efficiency.

Amazon Announces Voice Interoperability Initiative with Leading Technology Companies

September 26, 2019 by audioXpress Staff

Amazon Announces Voice Interoperability Initiative with Leading Technology Companies

Amazon, Baidu, Sony, BMW, Microsoft, Bose, Tencent, Orange, Salesforce, Harman, Logitech, Verizon, Sonos, Spotify, Sound United, and more are joining forces to promote choice by supporting multiple, interoperable voice services on a single device. The idea is to offer multiple, simultaneous wake words, so users can access multiple voice services by simply saying the corresponding wake word – from Alexa and Cortana to Orange’s Djingo, Salesforce’s Einstein, and more.

Audinate Announces Dante Reference Design for Popular NXP i.MX 8M Mini ARM-based Applications Processor

July 23, 2019 by audioXpress Staff

Audinate Announces Dante Reference Design for Popular NXP i.MX 8M Mini ARM-based Applications Processor

Audinate and NXP Semiconductors have collaborated to introduce a new reference design kit for the popular NXP i.MX 8M Mini QuadLite SoC – providing Dante audio-over-IP to OEMs as on-chip software. Following the announced shift from purpose-built hardware to software-based solutions running on standardized hardware, and a similar agreement to supply software running on Linux for x86 and ARM processors, Audinate now extends the support to NXP’s i.MX 8M processors.

Trends in Microspeakers

July 2, 2019 by Mike Klasco

Trends in Microspeakers

Voice Coil April 2019 featured another great Focus article by Mike Klasco (Menlo Scientific) discussing trends in Microspeakers. With more than 1.6 billion mobile phones built annually, each with a microspeaker for the speakerphone and another for the receiver, this side of the speaker industry attracts the giants. Get the full scoop on one of the hottest market segments.

NXP to Acquire Wi-Fi and Bluetooth Connectivity Assets from Marvell

May 31, 2019 by audioXpress Staff

NXP to Acquire Wi-Fi and Bluetooth Connectivity Assets from Marvell

NXP Semiconductors N.V. announced that its wholly owned subsidiary has entered into a definitive agreement with Marvell to acquire Marvell’s Wireless Connectivity portfolio in an all-cash, asset transaction valued at $1.76 billion. The acquisition encompasses Marvell’s Wi-Fi Connectivity Business Unit, Bluetooth technology portfolio and related assets. NXP expects the acquisition to create new revenue opportunities in its target end markets, including connected devices, automotive and communication infrastructure applications.

Mymanu CLIK S All-In-One Truly Wireless Earbuds Unveiled at MWC 2019

February 26, 2019 by audioXpress Staff

Mymanu CLIK S All-In-One Truly Wireless Earbuds Unveiled at MWC 2019

British start-up Mymanu is determined to embrace new challenges, again, with the launch of what the company calls “the most affordable, All-In-One truly wireless earbuds” with extended features. Unveiled at MWC 2019, in Barcelona and targeted to cost 79$ on pre-order, the new Mymanu CLIK S earbuds have been designed with fitness, music and travel lovers in mind. And as with previous initiatives from Mymanu, the focus continues to be the use of TWS earbuds for language translation, supported with a connected smartphone and app.

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