All items tagged with Menlo Scientific (174)
AES Headphone Technology Conference to Dig Deep into Emerging Audio Technologies and Applications
August 26, 2019 by Audio Engineering_Society

AES Headphone Technology Conference to Dig Deep into Emerging Audio Technologies and Applications

The AES is set to hold its second International Headphone Technology Conference, August 27–29 at the Golden Gate Club, Presidio, San Francisco, CA, offering three days of presentations, sessions, demonstrations, and more, all dedicated to headphone technology. Mobile Spatial Audio, Individualization, Assistive Listening and Audio for Augmented Reality offer new areas of study and innovation for this year’s conference.
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AES New York 2019 Product Development Track: The New Era of Product Development
August 12, 2019 by Audio Engineering_Society

AES New York 2019 Product Development Track: The New Era of Product Development

As audio product development surges forward at a breakneck pace, the 147th Audio Engineering Society International Convention is the premier destination for audio product developers to enhance their trade. Each year the Product Development Track presents four days of themed Workshops during the AES Convention. Building on last year’s theme “Make Audio Matter,” the 2019 Product Development Track is built on the theme “The New Era of Product Development.”
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Loudspeaker Enclosure Materials (Part 2)
July 31, 2019 by Mike Klasco

Loudspeaker Enclosure Materials (Part 2)

In the first part of this article, Mike Klasco discussed the contribution of the enclosure on perceived overall product quality as well as sonic clarity. This second part of the article looks closely at material testing, evaluation and manufacturability, and other more recent approaches to enclosure materials, including Thermosets and Thermoplastics, Bulk-Molded and Sheet-Molded Thermosets. This article was originally published in Voice Coil, May 2019.
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Loudspeaker Enclosure Materials (Part 1)
July 24, 2019 by Mike Klasco

Loudspeaker Enclosure Materials (Part 1)

In this article for Voice Coil, Mike Klasco (Menlo Scientific, Ltd.) reviews and looks ahead at all the materials and design approaches for loudspeaker enclosures. This article discusses enclosures using wood, MDF, plastic, plastic composites, moldable materials, coatings and pairings for those materials, while also looking at new cutting-edge bio-plastics materials. This article was originally published in Voice Coil, March 2019.
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Get Up Close with the Loudspeaker Experts in Voice Coil August 2019
July 24, 2019 by audioXpress Staff

Get Up Close with the Loudspeaker Experts in Voice Coil August 2019

Voice Coil August 2019 is now ready for you to download and it is in the mail for print subscribers. In this month’s edition, don’t miss the ALMA International Symposium & Expo (AISE) 2019 report, and the valuable Global Voice Coil Manufacturers 2019 updated directory. In Acoustic Patents, James Croft takes a closer look at two automotive patents granted to Harman and Bose. And Vance Dickason characterizes two different woofers from the new SEAS Excel Graphene product line. Download your copy now!
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Microspeakers' Anatomy - How to Design Audio Systems with Very Small Drivers
July 16, 2019 by Mike Klasco and Steve Tatarunis

Microspeakers' Anatomy - How to Design Audio Systems with Very Small Drivers

Audio sound quality optimization in a smartphone, mobile device, display, or laptop computer is the focus here. The goal of this article is not to teach how to design a good microspeaker, but rather to provide information on how to design a good mobile audio system, touching upon speaker design and speaker enclosure techniques. This article was originally published in Voice Coil, May 2010.
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Remembering the Electro-Voice T35 Super Tweeter
July 9, 2019 by Mike Klasco

Remembering the Electro-Voice T35 Super Tweeter

Do you remember the Electro-Voice T35 Super Tweeter? This was a high-performance horn tweeter that even today has state-of-the-art wideband response, high sensitivity, and a history that spans over six decades! This trip down memory lane relates the story of the T35, with a look at not just the tweeters, but also the people behind these developments. This article was originally published in Voice Coil, April 2010.
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Trends in Microspeakers
July 2, 2019 by Mike Klasco

Trends in Microspeakers

Voice Coil April 2019 featured another great Focus article by Mike Klasco (Menlo Scientific) discussing trends in Microspeakers. With more than 1.6 billion mobile phones built annually, each with a microspeaker for the speakerphone and another for the receiver, this side of the speaker industry attracts the giants. Get the full scoop on one of the hottest market segments.
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The Latest Resources for Transducer Measurement and Design in Voice Coil July 2019
June 26, 2019 by audioXpress Staff

The Latest Resources for Transducer Measurement and Design in Voice Coil July 2019

The July 2019 edition of Voice Coil is now available and loaded with valuable articles, starting with an overview of the new Klippel Controlled Sound (KCS) technology, followed by a detailed article on headphone measurement, and a new backward concept for designing vented enclosures. The July edition also features an updated directory of Adhesives, Coatings, Sealant, and Dispenser Providers. In Test Bench, Vance Dickason characterizes a Faital Pro midrange woofer and a coaxial driver from Tang Band (TB) Speaker. Download your copy now!
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ALMA, ALTI, and AISE 2019. What Happened in Orlando...
June 20, 2019 by Joao Martins

ALMA, ALTI, and AISE 2019. What Happened in Orlando...

The annual ALMA International Symposium & Expo (AISE) 2019, took place June 9–10 at the DoubleTree by Hilton at Universal Orlando, just prior to InfoComm 2019. Once again, it was the strongest event ever for anyone in the loudspeaker and electroacoustic development in general. This was the first event since the association decided to move away from Las Vegas and CES, and leverage the opportunities of working closer with the Audiovisual and Integrated Experience Association (AVIXA) and its annual trade show, InfoComm.
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