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Apple Introduces Beats Studio Buds with ANC and new TWS Form Factor
by Joao Martins

Apple Introduces Beats Studio Buds with ANC and new TWS Form Factor

Beats - the leading audio brand that also belongs to Apple - announced Beats Studio Buds, a new powerful true wireless earbud design that delivers a high-quality audio experience in a new, lightweight and comfortable design. Sweat- and water-resistant earbuds with an IPX4 rating and up to 24 hours of battery life, the new Beats Studio Buds add quality Active Noise Cancellation, Transparency and for the first time ever, convenient one-touch pairing to both iOS and Android users.
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Apogee Introduces New Duet 3 Portable USB-C Audio Interface
by audioXpress Staff

Apogee Introduces New Duet 3 Portable USB-C Audio Interface

Apogee Electronics, the Californian company that also goes for the name Apogee Digital, announced the all new Duet 3. This new portable USB-C audio interface is a 2 in x 4 out solution with on-board hardware DSP. The new Duet 3 is the latest generation in the popular series and combines the recognized Apogee AD/DA conversion performance with a stunning ultra-low profile industrial design using scratch resistant glass and an aluminum chassis.
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Ora Graphene Announces Strategic Investment to Advance GrapheneQ Commercialization
by audioXpress Staff

Ora Graphene Announces Strategic Investment to Advance GrapheneQ Commercialization

Ora Sound Graphene, the Canadian company that is the world's first commercial producer of free-standing graphene membranes for speaker drivers, announced the closing of its $3 million Seed financing round today. The deal was led by Ecofuel Fund along with Export Development Canada (EDC), BDC Capital and certain members of New York Angels. Existing investors TandemLaunch, and BoxOne Ventures also participated in the round.
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Martin Audio Promotes from Within to Fulfill R&D Director Roles
by audioXpress Staff

Martin Audio Promotes from Within to Fulfill R&D Director Roles

Known for its innovative and constantly updated professional loudspeaker systems, British sound reinforcement powerhouse Martin Audio has recently promoted from within to create two new director roles for its R&D department. Phil Anthony has been promoted to Associate Director of Design, while Ambrose Thompson is now Research Director, and together they will lead the R&D department.
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Listen's New AmpConnect 621 Hi-Res Multichannel Audio Interface Is Now Shipping
by audioXpress Staff

Listen's New AmpConnect 621 Hi-Res Multichannel Audio Interface Is Now Shipping

The Listen AmpConnect 621 was unveiled earlier with the launch of SoundCheck 19 software, and is now available. The new multichannel, multifunction, high resolution audio test interface includes all the functionality required for audio testing in just one unit, including an amplifier, microphone power supply, line outputs and digital I/O. And with a sample rate of up to 192kHz, it supports measuring high resolution audio designs.
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Bang & Olufsen Adopts Fraunhofer IIS LC3plus Audio Codec for High-Resolution Wireless Audio Products
by audioXpress Staff

Bang & Olufsen Adopts Fraunhofer IIS LC3plus Audio Codec for High-Resolution Wireless Audio Products

In order to meet the quality expectations of their users, high-end consumer electronics manufacturer Bang & Olufsen decided on the new open standard LC3plus codec from Fraunhofer IIS for their wireless streaming devices. LC3plus is currently the most advanced solution that combines support for high-resolution audio with low delay. LC3plus has been standardized by ETSI as TS 103 634, and is the first solution to support high-resolution music streaming services also over wireless accessories.
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DSP Concepts Adds delResearch's Data-Over-Sound Technology to Audio Weaver
by audioXpress Staff

DSP Concepts Adds delResearch's Data-Over-Sound Technology to Audio Weaver

DSP Concepts announced it has added delResearch's AirModem to the Audio Weaver feature set. AirModem offers a secure wireless alternative to Bluetooth and allows for two-way data transfer between phones, computers, and other connected devices without the need for specialized hardware: just speakers and microphones. AirModem packages years of sophisticated software research and development into a plug-and-play solution that can be added to any smart product design instantly with Audio Weaver.
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Universal Audio Acquires Microphone Modeling Pioneer Townsend Labs
by audioXpress Staff

Universal Audio Acquires Microphone Modeling Pioneer Townsend Labs

Universal Audio (UA) expanded its already unique portfolio of professional audio recording hardware and software, now announcing an asset purchase agreement with Townsend Labs Inc., the company behind the TEC award-winning Sphere L22 Microphone System. With the studio market seeing increasing acceptance of microphone modeling technology, the Townsend Labs Sphere L22 microphone system is a valuable addition to UA's recording product line.
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Explore Audio Amplifier Technology and Design in audioXpress July 2021
by audioXpress Staff

Explore Audio Amplifier Technology and Design in audioXpress July 2021

One of the strongest issues ever in terms of audio electronics and market insights, audioXpress July 2021 is now available. This edition includes a complete overview of Audio Amplifier Technology and Design and its many application segments. Start with a review of the NAD Electronics M33 Masters streaming amplifier, followed by a great new upgrade design for the legendary Hafler DH-220 lateral MOSFET power amplifier, and then dive into a new hybrid voltage source and current source amplifier design for loudspeakers.
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Achieving Loudspeaker Design Goals Using Multiphysics Simulation
by audioXpress Staff

Achieving Loudspeaker Design Goals Using Multiphysics Simulation

Dolby Laboratories and COMSOL join the Audio Product Education Institute in a discussion on the role of modeling and measurements in the loudspeaker design process. The webinar, June 16 (12pm EDT) shares speaker design project experiences, detailing how simulation, measurements, and experiments help in meeting projects' requirements. The use of simulation in audio system design and multiphysics modeling of loudspeakers is addressed.
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