Together, Cirrus Logic and GlobalFoundries are advancing the development and commercialization of next-generation BCD (Bipolar-CMOS-DMOS) process technology, which allows analog, digital, and power functions to be combined on a single chip, making devices more power-efficient and compact. This technology, essential for audio amplifiers and RF devices, will be capable of being manufactured at GlobalFoundries' facility in Malta, New York, adding a US-based option to complement existing manufacturing in Singapore and Germany. The expanded collaboration is expected to support Cirrus Logic’s commitment to delivering cutting-edge mixed-signal products to its core markets while strengthening the resilience and geographic diversity of its customers’ semiconductor supply chains.
Cirrus Logic and GF are also collaborating on accelerating innovation in Gallium Nitride (GaN) technology utilizing GF's specialized manufacturing facility in Essex Junction, Vermont. With a high-power density and the ability to handle high voltages, GF’s GaN-on-silicon platform offers efficiency and power management benefits for consumer and industrial applications. This joint effort is expected to expand Cirrus Logic’s mixed-signal and power technology portfolio, unlocking new capabilities and market opportunities.
"We are excited to deepen our long-standing relationship with GlobalFoundries and help accelerate cutting-edge mixed-signal chip manufacturing to the U.S.," says John Forsyth, Cirrus Logic President and Chief Executive Officer. "This collaboration expands the technology leadership of both companies, strengthens the U.S. semiconductor supply chain, and reinforces our shared commitment to innovation and customer success."
"GlobalFoundries is proud to expand our partnership with Cirrus Logic, a company that shares our commitment to driving semiconductor innovation and strengthening domestic manufacturing capabilities that are vital to national competitiveness and economic resilience," adds Tim Breen, CEO of GlobalFoundries. "Together, we’re enabling the next generation of essential chip technologies that will power tomorrow’s devices and systems. This collaboration underscores the importance of resilient, geographically diverse supply chains for our industry."
GlobalFoundries also recently completed its acquisition of MIPS, reinforcing the company's position in AI, edge computing, and other high-growth markets. The somewhat unusual combination of GlobalFoundries and MIPS is intended to accelerate processor IP innovation, enabling more differentiated solutions to meet the growing demand for energy-efficient, high-performance computing.
Like ARM, MIPS is expected to continue to operate as a standalone business within GlobalFoundries, maintaining its licensing model and focusing on serving a broad customer base across diverse technology sectors.
As it reinforces its ties with American companies, GlobalFoundries has entered into an agreement with Apple for a deeper collaboration that will strengthen its US manufacturing options. The partnership with Apple will enable GlobalFoundries to accelerate investments at its state-of-the-art semiconductor manufacturing facility in Malta, New York, where it will produce power-efficient, wireless technologies that are essential to the future of mobile devices.
"This announcement is a significant milestone in our decade-long partnership with Apple, as we work together to manufacture critical wireless connectivity technologies and power management solutions, key parts of next-generation AI-enabled devices," explained Tim Breen. "This is a testament to GF’s technology differentiation, coupled with our unique secure and onshore capabilities, and the trust Apple has placed in GF to deliver and build the advanced chips that power its next-generation smart mobile technologies. This agreement builds on our prior announcements and reinforces our shared commitment to strengthening U.S. semiconductor manufacturing and building a more resilient onshore supply chain."
In June 2025, GlobalFoundries announced plans to invest US $16 billion to expand semiconductor manufacturing and advanced packaging across its facilities in New York and Vermont.
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